US 12,217,905 B2
Electronic component
Hidenobu Umeda, Tokyo (JP); Masaki Takahashi, Tokyo (JP); Kaori Sasaki, Tokyo (JP); and Nami Enomoto, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Oct. 31, 2022, as Appl. No. 17/977,038.
Claims priority of application No. 2021-189588 (JP), filed on Nov. 22, 2021.
Prior Publication US 2023/0162910 A1, May 25, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01)
CPC H01F 27/324 (2013.01) [H01F 27/2804 (2013.01); H01F 41/043 (2013.01); H01F 41/125 (2013.01); H01F 2027/2809 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a glass ceramic layer; and
a conductor layer, wherein
the glass ceramic layer includes feldspar crystal phases, non-crystalline glass phases, and Al2O3 fillers of Al2O3 phases; and
an area ratio of the feldspar crystal phases in a vicinity of the conductor layer is larger than an area ratio of the feldspar crystal phases away from the conductor layer.