US 12,217,896 B2
Coil component
Chan Yoon, Suwon-si (KR); Dong Hwan Lee, Suwon-si (KR); Dong Jin Lee, Suwon-si (KR); and Sang Soo Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 9, 2020, as Appl. No. 17/116,091.
Claims priority of application No. 10-2020-0087633 (KR), filed on Jul. 15, 2020.
Prior Publication US 2022/0020523 A1, Jan. 20, 2022
Int. Cl. H01F 27/29 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/255 (2013.01); H01F 27/29 (2013.01); H01F 27/32 (2013.01); H01F 41/041 (2013.01); H01F 41/12 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A coil component, comprising:
a body;
a planar spiral-shaped coil portion disposed in the body, the coil portion having a core penetrating through a center thereof;
a conducting lead portion disposed to be spaced apart from the coil portion in the body without overlapping the core;
an insulating support substrate disposed between the coil portion and the lead portion, and overlapping the coil portion only in a region where the coil portion and the lead portion overlap;
a via penetrating through the support substrate to connect an internal end portion of the coil portion and an internal end portion of the lead portion to each other;
an insulating layer covering the coil portion and the lead portion; and
a first external electrode disposed on a side surface of the body and connected to an external side surface of the lead portion.