US 12,217,636 B2
Stretchable display device
Hyunju Jung, Seoul (KR); and Eunah Kim, Seosan-si (KR)
Assigned to LG Display Co., Ltd., Seoul (KR)
Filed by LG Display Co., Ltd., Seoul (KR)
Filed on May 23, 2023, as Appl. No. 18/322,462.
Application 18/322,462 is a division of application No. 16/913,457, filed on Jun. 26, 2020, granted, now 11,699,363.
Claims priority of application No. 10-2019-0078134 (KR), filed on Jun. 28, 2019; and application No. 10-2020-0051688 (KR), filed on Apr. 28, 2020.
Prior Publication US 2023/0298490 A1, Sep. 21, 2023
Int. Cl. G09F 9/30 (2006.01); H10K 50/844 (2023.01); H10K 59/12 (2023.01); H10K 59/121 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01); H10K 102/10 (2023.01)
CPC G09F 9/301 (2013.01) [H10K 50/844 (2023.02); H10K 59/121 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 2102/101 (2023.02)] 15 Claims
OG exemplary drawing
 
1. A method of manufacturing a display device, the method comprising:
forming a plurality of individual substrates on a lower substrate;
forming a connection support layer extending between adjacent individual substrates;
forming a transistor on each of the plurality of individual substrates;
depositing a first inorganic layer on each of the individual substrates, the inorganic having a sidewall surface extending upward from the individual substrate;
depositing an organic layer overlying the individual substrates and the inorganic layer, including the sidewall of the inorganic layer and the lower substrate;
patterning and etching the organic layer to remove it from lower substrate;
depositing an electrically conductive connection layer overlying the connection support layer;
patterning and etching the electrically conductive connection layer to form a connection line extending between adjacent individual substrates;
wherein the step of forming the connection support includes:
etching of the connection support layer,
wherein the step of etching the connection support layer creates and undercut below the inorganic layer, the method further comprising:
filling the undercut with the organic layer during the step of depositing the organic layer.