US 12,217,112 B2
IC card and method for manufacturing IC card
Yukiko Katano, Tokyo (JP); Tetsuya Tsukada, Tokyo (JP); and Shin Kataoka, Tokyo (JP)
Assigned to TOPPAN INC., Tokyo (JP)
Filed by TOPPAN INC., Tokyo (JP)
Filed on Apr. 14, 2023, as Appl. No. 18/134,959.
Application 18/134,959 is a continuation of application No. PCT/JP2021/035566, filed on Sep. 28, 2021.
Claims priority of application No. 2020-177186 (JP), filed on Oct. 22, 2020.
Prior Publication US 2023/0259734 A1, Aug. 17, 2023
Int. Cl. G06K 19/07 (2006.01); G06K 19/073 (2006.01)
CPC G06K 19/07354 (2013.01) 8 Claims
OG exemplary drawing
 
1. An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC chip comprising:
an ultrasonic fingerprint sensor connected to the IC chip; and
a storage unit in which fingerprint data for matching is stored; wherein
an outer surface of the IC card is formed of synthetic resin, and
the ultrasonic fingerprint sensor is covered with the synthetic resin, wherein
the IC card comprises:
a flexible substrate comprising a polyimide base material;
a conductor layer on the flexible substrate, the IC chip, the storage unit and the fingerprint sensor are patterned in said conductor layer;
a resin frame on the flexible substrate, the resin frame having an opening that exposes the IC chip, the storage unit and the fingerprint sensor; and
a cured resin layer in the opening of the resin frame, the cured resin layer sealing the IC chip, the storage unit and the fingerprint sensor.