US 12,216,975 B2
Methods and systems for printed circuit board component placement and approval
Curtis Hunter, Kitchener (CA); and David Workman, Kitchener (CA)
Assigned to Boardera Software 1nc., Kitchener (CA)
Filed by BOARDERA SOFTWARE INC., Kitchener (CA)
Filed on Dec. 28, 2023, as Appl. No. 18/399,436.
Application 18/399,436 is a continuation of application No. 17/485,634, filed on Sep. 27, 2021, granted, now 11,900,033.
Prior Publication US 2024/0126963 A1, Apr. 18, 2024
Int. Cl. G06F 30/30 (2020.01); G06F 30/31 (2020.01); G06F 30/392 (2020.01); H05K 3/00 (2006.01); H05K 13/00 (2006.01); G06F 115/12 (2020.01)
CPC G06F 30/31 (2020.01) [G06F 30/392 (2020.01); H05K 3/0005 (2013.01); G06F 2115/12 (2020.01); H05K 13/0015 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for printed circuit board (PCB) component placement comprising:
receiving one or more electronic PCB design files defining a PCB design;
processing the one or more electronic PCB design files to determine which PCB design features of the PCB design are electrical contact features; and
for each electrical component of a plurality of electrical components to be assembled with the PCB design:
determining whether a footprint of the electrical component positioned and oriented in accordance with first XYRS data for the electrical component would register with electrical contact features of the PCB design;
in the event that the footprint of the electrical component positioned and oriented in accordance with first XYRS data for the electrical component would not register with electrical contact features of the PCB design:
conducting a corrective procedure to determine an X-Y position and orientation of the footprint that would register with a set of electrical contact features of the PCB design; and
generating second XYRS data for the electrical component based at least on the determined X-Y position and orientation of the footprint.