US 12,216,540 B2
Semiconductor chip for correcting aligned error, semiconductor system for correcting aligned error, and method for correcting aligned error
Jung Rae Kim, Suwon-si (KR); Sang Hyo Kim, Suwon-si (KR); Seokin Hong, Suwon-si (KR); and Yuseok Song, Suwon-si (KR)
Assigned to Research & Business Foundation Sungkyunkwan University, Suwon-si (KR)
Filed by Research & Business Foundation SUNGKYUNKWAN UNIVERSITY, Suwon-si (KR)
Filed on Apr. 26, 2023, as Appl. No. 18/139,440.
Claims priority of application No. 10-2022-0051613 (KR), filed on Apr. 26, 2022.
Prior Publication US 2023/0342246 A1, Oct. 26, 2023
Int. Cl. G06F 11/10 (2006.01); G06F 11/07 (2006.01)
CPC G06F 11/1068 (2013.01) [G06F 11/0784 (2013.01); G06F 11/1004 (2013.01)] 16 Claims
OG exemplary drawing
 
11. A method for correcting an aligned error performed by a semiconductor system including a memory chip including a first memory, and a control chip including an Error Correction Code (ECC) circuit for controlling the memory chip, comprising:
obtaining target data to be encoded, and encoding the target data by multiplying a generator matrix of an ECC which was generated previously;
storing the encoded target data in the first memory of the memory chip;
reading the encoded target data from the first memory of the memory chip or reading transformed transmission data which was transformed during transmission; and
generating an error corrected data by correcting single errors of the transformed transmission data and a plurality of double adjacent errors that does not exceed a first value boundary of a predetermined number of bits by using a parity check matrix of the ECC and outputting the error corrected data.