US 12,216,371 B2
Display device
Hiroyuki Abe, Tokyo (JP); and Kentaro Agata, Tokyo (JP)
Assigned to Japan Display Inc., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Apr. 18, 2023, as Appl. No. 18/302,284.
Application 18/302,284 is a continuation of application No. 17/192,209, filed on Mar. 4, 2021, granted, now 11,662,637.
Application 17/192,209 is a continuation of application No. 16/774,424, filed on Jan. 28, 2020, granted, now 10,976,624, issued on Apr. 13, 2021.
Application 16/774,424 is a continuation of application No. 15/833,062, filed on Dec. 6, 2017, granted, now 10,571,769, issued on Feb. 25, 2020.
Claims priority of application No. 2017-004029 (JP), filed on Jan. 13, 2017.
Prior Publication US 2023/0251539 A1, Aug. 10, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G02F 1/1362 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); G02F 1/1345 (2006.01); G09G 3/36 (2006.01)
CPC G02F 1/136286 (2013.01) [G02F 1/133345 (2013.01); G02F 1/1339 (2013.01); G02F 1/1345 (2013.01); G02F 1/13452 (2013.01); G09G 3/3688 (2013.01); G02F 1/13454 (2013.01); G02F 1/13456 (2021.01); G02F 1/13458 (2013.01); G02F 1/13629 (2021.01); G02F 1/136295 (2021.01); G09G 2300/0408 (2013.01); G09G 2300/0426 (2013.01); G09G 2300/0452 (2013.01); G09G 2310/0297 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A display device comprising:
an array substrate including a terminal, a glass substrate, a first insulating film, a second insulating film on the first insulating film, a first wiring layer between the glass substrate and the first insulating film, and a second wiring layer between the first insulating film and the second insulating film;
an opposite substrate; and
a semiconductor chip connected to the terminal of the array substrate,
wherein
a first region of the array substrate overlaps the opposite substrate,
a second region of the array substrate does not overlap the opposite substrate,
a substrate edge of the opposite substrate is a border between the first region and the second region of the array substrate,
a first wiring formed on the first wiring layer is pulled out from the terminal in the second region,
a second wiring formed on the second wiring layer is connected to the first wiring via a first opening formed in the first insulating film in the second region,
the first opening is located in the second region, and does not overlap the opposite substrate, and
the second wiring crosses the substrate edge of the opposite substrate in a plan view
wherein the first opening overlaps the second insulating film;
wherein the first wiring is fed a video signal by the semiconductor chip; and
further comprising:
a third wiring formed on the first wiring layer and connected to the second wiring via a second opening formed in the first insulating film in the first region, wherein
the second opening overlaps the opposite substrate, and
the second opening overlaps the second insulating film.