US 12,216,318 B2
Optical bridging element for separately stacked electrical ICs
Philip Winterbottom, San Jose, CA (US); David Lazovsky, Los Gatos, CA (US); Ankur Aggarwal, Pleasanton, CA (US); Martinus Bos, San Jose, CA (US); and Subal Sahni, La Jolla, CA (US)
Assigned to Celestial AI Inc., Santa Clara, CA (US)
Filed by Celestial AI Inc., Santa Clara, CA (US)
Filed on Mar. 20, 2024, as Appl. No. 18/610,502.
Application 18/610,502 is a division of application No. 18/243,474, filed on Sep. 7, 2023, granted, now 12,124,095.
Application 18/243,474 is a continuation of application No. 18/123,083, filed on Mar. 17, 2023, granted, now 11,835,777, issued on Dec. 5, 2023.
Claims priority of provisional application 63/420,330, filed on Oct. 28, 2022.
Claims priority of provisional application 63/321,453, filed on Mar. 18, 2022.
Claims priority of provisional application 63/448,585, filed on Feb. 27, 2023.
Prior Publication US 2024/0219664 A1, Jul. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/42 (2006.01); G02B 6/43 (2006.01); G02F 1/015 (2006.01)
CPC G02B 6/4295 (2013.01) [G02B 6/4246 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01); G02F 1/0157 (2021.01); G02B 6/4245 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A package with a first die, the first die comprising:
a first interconnect region;
a first photonic transceiver portion electrically coupled with the first interconnect region;
a second interconnect region electrically coupled with the first interconnect region via an electrical coupling included in the first die;
a first photonic path from the first photonic transceiver portion to an optical interface (OI); and
a second photonic path from the OI to the first photonic transceiver portion;
wherein:
the first interconnect region is configured to electrically couple the first photonic transceiver portion to a second photonic transceiver portion residing in an analog/mixed-signal die (an AMS die);
the second interconnect region is configured to electrically couple an interface (I/F1), residing in a general die, to the second photonic transceiver portion; and
electrical interconnects in the first interconnect region are less than two millimeters (2 mm) in length.