US 12,216,317 B2
Multi-channel optical sub-assembly
Eun Kyu Kang, Daejeon (KR); Jong Jin Lee, Daejeon (KR); Dae Seon Kim, Daejeon (KR); Sang Jin Kwon, Daejeon (KR); Won Bae Kwon, Daejeon (KR); Soo Yong Jung, Daejeon (KR); Hae Chung Kang, Daejeon (KR); Dae Woong Moon, Daejeon (KR); and Gye Sul Cho, Daejeon (KR)
Assigned to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon (KR)
Filed by Electronics and Telecommunications Research Institute, Daejeon (KR)
Filed on Aug. 2, 2022, as Appl. No. 17/879,008.
Claims priority of application No. 10-2021-0115715 (KR), filed on Aug. 31, 2021; and application No. 10-2021-0164634 (KR), filed on Nov. 25, 2021.
Prior Publication US 2023/0061382 A1, Mar. 2, 2023
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4251 (2013.01) [G02B 6/4214 (2013.01); G02B 6/428 (2013.01); G02B 6/4201 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multi-channel optical sub-assembly comprising:
a printed circuit board with a signal processor mounted thereon;
a package window mounted on the printed circuit board, the package window including a transparent material;
a package mounted on the package window; and
an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal,
wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.