US 12,216,158 B2
Contactless optical probing of edge-coupled photonic ICs
Jeremy Hicks, Santa Clara, CA (US); Hari Mahalingam, San Jose, CA (US); Christopher Seibert, Santa Clara, CA (US); Eric Snow, Berkeley, CA (US); and Harel Frish, Albuquerque, NM (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Nov. 24, 2020, as Appl. No. 17/102,891.
Prior Publication US 2022/0163583 A1, May 26, 2022
Int. Cl. G01R 31/311 (2006.01); G02B 6/30 (2006.01); G02B 6/42 (2006.01)
CPC G01R 31/311 (2013.01) [G02B 6/4214 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A photonic integrated circuit (PIC), comprising:
a photonic waveguide over a substrate material, wherein a terminus of the waveguide comprises a PIC-to-fiber edge coupler (EC);
a first trench within the substrate material, wherein a terminus of the first trench abuts the EC; and
a second trench bifurcating the first trench into trench lengths that are on opposite sides of the second trench and between the EC and a fiber land where a fiber is to be mounted to the PIC.