US 12,216,154 B2
Active thermal interposer device
Samer Kabbani, Laguna Niguel, CA (US); Paul Ferrari, Mission Viejo, CA (US); Ikeda Hiroki, Kukishi Saitama (JP); Kiyokawa Toshiyuki, Kukishi Saitama (JP); Gregory Cruzan, Anaheim, CA (US); Karthik Ranganathan, Foothill Ranch, CA (US); Todd Berk, Rancho Santa Margarita, CA (US); Ian Williams, Huntington Beach, CA (US); Mohammad Ghazvini, Laguna Niguel, CA (US); and Thomas Jones, San Jose, CA (US)
Assigned to Advantest Test Solutions, Inc., San Jose, CA (US)
Filed by Advantest Test Solutions, Inc., San Jose, CA (US)
Filed on May 31, 2023, as Appl. No. 18/204,309.
Application 18/204,309 is a continuation of application No. 17/841,471, filed on Jun. 15, 2022, granted, now 11,846,669.
Application 17/841,471 is a continuation of application No. 17/531,638, filed on Nov. 19, 2021, granted, now 11,609,266, issued on Mar. 21, 2023.
Claims priority of provisional application 63/121,532, filed on Dec. 4, 2020.
Prior Publication US 2024/0003967 A1, Jan. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 31/28 (2006.01); G01R 1/04 (2006.01)
CPC G01R 31/2875 (2013.01) [G01R 1/0458 (2013.01); G01R 31/2863 (2013.01); G01R 31/2867 (2013.01); G01R 31/2874 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A discrete active thermal interposer device for use in testing an unpackaged integrated circuit device under test (“DUT”), said discrete active thermal interposer device comprising:
a body layer comprising a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate; and
a plurality of heating zones defined across the second surface of said body layer, said plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when a surface of said DUT is disposed on said second surface of said body layer during testing of said DUT.