US 12,216,140 B2
Tilt calibration for probe systems
Peter D. Brewer, Westlake Village, CA (US); Chia-Ming Chang, Agoura Hills, CA (US); Sevag Terterian, Lake Balboa, CA (US); Charbel Abijaoude, Newbury Park, CA (US); and Diego Eduardo Carrasco, Los Angeles, CA (US)
Assigned to The Boeing Company, Arlington, VA (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Oct. 17, 2022, as Appl. No. 18/047,155.
Prior Publication US 2024/0125817 A1, Apr. 18, 2024
Int. Cl. G01R 1/073 (2006.01); G01B 7/00 (2006.01); G01B 21/22 (2006.01)
CPC G01R 1/07307 (2013.01) [G01B 7/003 (2013.01); G01B 21/22 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A probing system comprising:
a device-under-test that includes a plurality of test patterns on a first surface;
a probe device that includes a plurality of tilt angle sensors, wherein the plurality of tilt angle sensors include a plurality of spikes that protrude from a second surface of the probe device; and
a die bonder having a spherical positioner that is adjustable in a plurality of rotational axes, wherein the die bonder is operational to:
mount the device-under-test with the first surface facing outward;
mount the probe device with the second surface of the probe device facing the first surface of the device-under-test;
compress the probe device and the device-under-test together with a first force that causes a subset of the plurality of spikes to contact the plurality of test patterns;
measure a number of electrical connections formed between the plurality of tilt angle sensors and the plurality of test patterns;
determine a first offset angle and a second offset angle between the first surface of the device-under-test and the second surface of the probe device based on the number of electrical connections;
separate the probe device from the device-under-test; and
adjust the spherical positioner in one or more of the plurality of rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the first surface of the device-under-test and the second surface of the probe device.