CPC G01R 1/07307 (2013.01) [G01B 7/003 (2013.01); G01B 21/22 (2013.01)] | 20 Claims |
1. A probing system comprising:
a device-under-test that includes a plurality of test patterns on a first surface;
a probe device that includes a plurality of tilt angle sensors, wherein the plurality of tilt angle sensors include a plurality of spikes that protrude from a second surface of the probe device; and
a die bonder having a spherical positioner that is adjustable in a plurality of rotational axes, wherein the die bonder is operational to:
mount the device-under-test with the first surface facing outward;
mount the probe device with the second surface of the probe device facing the first surface of the device-under-test;
compress the probe device and the device-under-test together with a first force that causes a subset of the plurality of spikes to contact the plurality of test patterns;
measure a number of electrical connections formed between the plurality of tilt angle sensors and the plurality of test patterns;
determine a first offset angle and a second offset angle between the first surface of the device-under-test and the second surface of the probe device based on the number of electrical connections;
separate the probe device from the device-under-test; and
adjust the spherical positioner in one or more of the plurality of rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the first surface of the device-under-test and the second surface of the probe device.
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