| CPC G01M 11/335 (2013.01) [G01M 11/0207 (2013.01); G01R 31/31728 (2013.01); G01R 31/318511 (2013.01); G02B 6/2932 (2013.01)] | 20 Claims |

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1. A photonic testing device comprising:
a wafer substrate comprising a plurality of die areas;
an optical device under test (DUT) located on the wafer substrate within a single die area of the plurality of die areas and comprising an input waveguide configured to receive a combined optical test signal, the optical DUT being configured to respond to the combined optical test signal; and
an optical input circuit located on the wafer substrate, the optical input circuit comprising
a first plurality of inputs configured to simultaneously receive a plurality of optical test signals provided at respective inputs of the first plurality of inputs, each of the first plurality of inputs having different at least partially nonoverlapping passbands that together span an extended range of wavelengths, each passband having a different respective dominant wavelength of a plurality of dominant wavelengths in the extended range of wavelengths, and
an output configured to combine the plurality of optical test signals into the combined optical test signal at the output, and transmit the combined optical test signal through the output to the input waveguide of the optical DUT.
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