US 12,216,009 B2
Arrangement and method for determining temperatures of electronic components
Horst Geyer, Erlangen (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Appl. No. 18/029,836
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Sep. 17, 2021, PCT No. PCT/EP2021/075578
§ 371(c)(1), (2) Date Mar. 31, 2023,
PCT Pub. No. WO2022/069252, PCT Pub. Date Apr. 7, 2022.
Claims priority of application No. 20199593 (EP), filed on Oct. 1, 2020.
Prior Publication US 2023/0299662 A1, Sep. 21, 2023
Int. Cl. G01K 7/42 (2006.01); H02M 1/32 (2007.01)
CPC G01K 7/42 (2013.01) [H02M 1/327 (2021.05); G01K 7/427 (2013.01); G01K 2217/00 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An arrangement, comprising:
a supply unit of an industrial control system, said supply unit including an electronic assembly which includes an electronic component, said supply unit configured to calculate a first temperature of the electronic component using a first thermal model; and
a superordinate computing unit assigned to the supply unit and configured to calculate a second temperature of the electronic component using a second thermal model, with the supply unit providing the superordinate computing unit with relevant data for a calculation of the second thermal model,
wherein the supply unit and the superordinate computing unit interact so that at least one of the first temperature and the second temperature of the electronic component is always calculated, and the superordinate computing unit can calculate the second temperature when the supply unit is without current and not operating, and the calculated second temperature can be used as an initial value when the supply unit is restarted.