US 12,215,972 B2
Sensor device
Junichi Inagaki, Ibaraki (JP); Takeshi Murashige, Ibaraki (JP); and Keisuke Sato, Ibaraki (JP)
Assigned to NITTO DENKO CORPORATION, Ibaraki (JP)
Appl. No. 17/424,429
Filed by NITTO DENKO CORPORATION, Ibaraki (JP)
PCT Filed Feb. 10, 2020, PCT No. PCT/JP2020/005156
§ 371(c)(1), (2) Date Jul. 20, 2021,
PCT Pub. No. WO2020/179376, PCT Pub. Date Sep. 10, 2020.
Claims priority of application No. 2019-040427 (JP), filed on Mar. 6, 2019.
Prior Publication US 2022/0090904 A1, Mar. 24, 2022
Int. Cl. G01B 7/16 (2006.01); B32B 17/10 (2006.01); C09J 7/38 (2018.01); G01L 1/22 (2006.01); G02B 5/30 (2006.01); G06F 3/041 (2006.01); G01L 1/20 (2006.01)
CPC G01B 7/16 (2013.01) [B32B 17/10 (2013.01); C09J 7/38 (2018.01); G01L 1/22 (2013.01); G02B 5/30 (2013.01); G06F 3/0412 (2013.01); B60G 2401/12 (2013.01); G01L 1/205 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A sensor device, comprising:
an optical laminate including a glass film, an adhesive layer, a resin layer, and a pressure-sensitive adhesive layer in the stated order; and
a strain-sensing unit,
wherein the glass film has a thickness of from 20 μm to 150 μm;
the resin layer and the pressure-sensitive adhesive layer are directly in contact with each other;
a modulus of elasticity of the adhesive layer at 23° C. ranges from 0.5 GPa to 15 GPa; and
the strain-sensing unit is configured to sense strain caused by an external force applied to a surface of the optical laminate.