	US 12,215,424 B2
	Metal resin composite, preparation method thereof, and electronic product housing having the same
Junlan Lian, Shenzhen (CN); Hongye Lin, Shenzhen (CN); Fan Chen, Shenzhen (CN); and Weitu Li, Shenzhen (CN)
Assigned to BYD COMPANY LIMITED, Shenzhen (CN)
Appl. No. 17/280,318
Filed by BYD COMPANY LIMITED, Shenzhen (CN)
PCT Filed Sep. 10, 2019, PCT No. PCT/CN2019/105097 § 371(c)(1), (2) Date Mar. 26, 2021, PCT Pub. No. WO2020/063324, PCT Pub. Date Apr. 2, 2020.
Claims priority of application No. 201811142235 (CN), filed on Sep. 28, 2018.
Prior Publication US 2022/0002876 A1, Jan. 6, 2022
Int. Cl. C23C 18/16 (2006.01); B29C 45/14 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01); C23C 18/31 (2006.01)

CPC C23C 18/1689 (2013.01) [B29C 45/14778 (2013.01); C23C 18/31 (2013.01); B29K 2705/00 (2013.01); B29L 2031/34 (2013.01)]

9 Claims

1. A preparation method for a metal resin composite, comprising:

forming a metal layer on a metal substrate;

forming a plurality of microcracks on a surface of the metal layer by contacting the metal layer on the metal substrate with a treating agent containing an acid and an oxidizing agent, wherein each microcrack is an elongate groove along the surface of the metal layer, and a depth of the microcracks is 2000-3000 nm and a width of the microcracks is 230-370 nm; and

forming a resin layer on the metal layer,

wherein at least a part of the plurality of microcracks are connected to each other and form an interconnected network of microcracks.