US 12,215,420 B2
Pedestal thermal profile tuning using multiple heated zones and thermal voids
Gary B. Lind, Penn Valley, CA (US); and Alok Mahadeva, Pune (IN)
Assigned to Lam Research Corporation, Fremont, CA (US)
Appl. No. 18/008,273
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
PCT Filed Jun. 4, 2021, PCT No. PCT/US2021/035835
§ 371(c)(1), (2) Date Dec. 5, 2022,
PCT Pub. No. WO2021/252276, PCT Pub. Date Dec. 16, 2021.
Claims priority of provisional application 63/036,650, filed on Jun. 9, 2020.
Prior Publication US 2023/0272529 A1, Aug. 31, 2023
Int. Cl. C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01)
CPC C23C 16/45544 (2013.01) [C23C 16/458 (2013.01); C23C 16/52 (2013.01); H01J 37/32724 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/3321 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A substrate support comprising:
a body configured to support a substrate during processing of the substrate, wherein the body comprises a plurality of plates comprising a top plate, a first intermediate plate, a second intermediate plate and a bottom plate, wherein the plurality of plates are arranged to form a stack, and wherein the first intermediate plate is disposed on the second intermediate plate; and
a thermal void defined by an upper recessed surface of the second intermediate plate and at least one of a lower recessed surface of the first intermediate plate or a lower recessed surface of the top plate, wherein the thermal void is annular-shaped.