US 12,215,256 B2
Dry adhesive comprising a shape memory polymer for attachment to a flexible adherend
Seok Kim, Pohang (KR); Placid M. Ferreira, Champaign, IL (US); and ChangHee Son, Urbana, IL (US)
Assigned to THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS, Urbana, IL (US)
Filed by The Board of Trustees of the University of Illinois, Urbana, IL (US)
Filed on Mar. 31, 2022, as Appl. No. 17/710,391.
Claims priority of provisional application 63/170,392, filed on Apr. 2, 2021.
Prior Publication US 2022/0315805 A1, Oct. 6, 2022
Int. Cl. C09J 7/35 (2018.01); C08L 63/00 (2006.01); C09J 5/06 (2006.01); C09J 7/00 (2018.01); C09J 7/22 (2018.01); C09J 163/00 (2006.01)
CPC C09J 7/35 (2018.01) [C08L 63/00 (2013.01); C09J 5/06 (2013.01); C09J 7/00 (2013.01); C09J 7/22 (2018.01); C08L 2201/12 (2013.01); C09J 163/00 (2013.01); C09J 2203/334 (2013.01); C09J 2203/358 (2020.08); C09J 2301/122 (2020.08); C09J 2301/304 (2020.08); C09J 2301/502 (2020.08); Y10T 428/28 (2015.01)] 11 Claims
OG exemplary drawing
 
1. A dry adhesive for attachment to a flexible adherend, the dry adhesive comprising:
a shape memory polymer layer having a glass transition temperature (Tg) above 25° C.;
an adhesive; and
a compliant backing layer bonded to the shape memory polymer layer by the adhesive,
wherein the shape memory polymer layer is configured to form a conformal and/or hermetic contact with a flexible adherend at temperatures at or above the Tg and to retain the conformal and/or hermetic contact during flexing of the flexible adherend at temperatures below the Tg, and
wherein the compliant backing layer has a flexural modulus of less than 4 GPa and a thickness less than 250 microns.