CPC B81B 3/0078 (2013.01) [H02N 1/008 (2013.01); B81B 2201/04 (2013.01); B81B 2203/0154 (2013.01); B81B 2203/058 (2013.01)] | 26 Claims |
1. A MEMS device, comprising:
a substrate;
a suspended element connected to a fixed part of the substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate;
a damping structure connected to the suspended element extending into a gap between the suspended element and the fixed part of the substrate wherein the damping structure includes one or more winglets that protrude over a recessed portion of the fixed part of the substrate; and
one or more fluid confinement structures formed by the recessed portion of the fixed substrate configured to permit movement of the damping structure over the recessed portion of the substrate and to confine a viscoelastic fluid to the limited portion of the gap underneath the one or more winglets.
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