US 12,214,607 B2
Image recording method
Takeshi Miyato, Kanagawa (JP); Michio Arai, Kanagawa (JP); Yusuke Fujii, Kanagawa (JP); and Kenji Shirokane, Kanagawa (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Jan. 24, 2022, as Appl. No. 17/582,222.
Application 17/582,222 is a continuation of application No. PCT/JP2020/027293, filed on Jul. 13, 2020.
Claims priority of application No. 2019-137000 (JP), filed on Jul. 25, 2019.
Prior Publication US 2022/0143998 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B41M 5/00 (2006.01); B41M 7/00 (2006.01); C09D 11/104 (2014.01); C09D 11/107 (2014.01); C09D 11/30 (2014.01)
CPC B41M 5/0064 (2013.01) [B41M 5/0017 (2013.01); B41M 5/0023 (2013.01); B41M 5/0047 (2013.01); B41M 7/009 (2013.01); C09D 11/104 (2013.01); C09D 11/107 (2013.01); C09D 11/30 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An image recording method comprising:
preparing a resin base material A in which an absolute value of a distortion rate represented by Equation (a1) in a case where the base material is heated from 25° C. to 60° C. at a temperature increasing rate of 5° C./min and maintained at 60° C. for 2 minutes in a state where a tension of 30 N/m is applied thereto, and the base material is cooled to 25° C. at a temperature decreasing rate of 5° C./min in a state where a tension of 30 N/m is applied thereto is 0.05% or greater;
preparing a pretreatment liquid containing water and a resin X;
preparing an ink containing water and a colorant;
sequentially applying the pretreatment liquid and the ink onto the resin base material A to which a tension S1 of 10 N/m or greater is applied to obtain an image;
heating and drying the image to a temperature Td of 50° C. or higher in a state where a tension S2 of 10 N/m or greater is applied to the resin base material A; and
cooling the image after the drying to a temperature Tr of 30° C. or lower in a state where a tension S3 of 10 N/m or greater is applied to the resin base material A,
wherein σtotal to be calculated by Equation (1) is 40 kgf/cm2 or less,
distortion rate(%)=((length of resin base material in tension application direction at end of cooling−length thereof in tension application direction at start of heating)/length thereof in tension application direction at start of heating)×100  Equation (a1)

OG Complex Work Unit Math
in Equation (1), σdry is calculated by Equation (2), and σcool is calculated by Equation (3),
in Equation (2),
E(Td) represents an elastic modulus of the resin X at the temperature Td which is expressed in a unit of kgf/cm2,
ε(Td) represents an expansion coefficient of the length of the resin base material A represented by Equation (a2) in the tension application direction in a case where the base material is heated from 25° C. to the temperature Td and maintained at the temperature Td in a state where the tension S2 is applied thereto, and the base material is cooled to 25° C. in a state where the tension S2 is applied thereto,
expansion coefficient of length of resin base material A in tension application direction=(length of resin base material in tension application direction at end of cooling−length thereof in tension application direction at start of heating)/length thereof in tension application direction at start of heating  Equation (a2)
in Equation (3),
E(T) represents an elastic modulus of the resin X at a temperature T of the image in the cooling which is expressed in the unit of kgf/cm2,
αr(T) represents a linear expansion coefficient of the resin X at the temperature T,
αs(T) represents a linear expansion coefficient of the resin base material A in the tension application direction in a state where the tension S3 is applied thereto at the temperature T,
Td represents the temperature Td, and
Tr represents the temperature Tr.