	US 12,214,580 B2
	Method for transferring a layer to a substrate
Boshen Liang, Herent (BE); Dominika Wysocka, Leuven (BE); and David Cheyns, Heffen (BE)
Assigned to IMEC VZW, Leuven (BE); and Katholieke Universiteit Leuven, KU LEUVEN R&D, Leuven (BE)
Filed by IMEC VZW, Leuven (BE); and Katholieke Universiteit Leuven, KU LEUVEN R&D, Leuven (BE)
Filed on Jun. 7, 2022, as Appl. No. 17/834,413.
Claims priority of application No. 21178581 (EP), filed on Jun. 9, 2021.
Prior Publication US 2022/0396067 A1, Dec. 15, 2022
Int. Cl. B32B 43/00 (2006.01); B32B 37/24 (2006.01); B81C 1/00 (2006.01)

CPC B32B 43/006 (2013.01) [B32B 37/24 (2013.01); B81C 1/00238 (2013.01); B32B 2037/243 (2013.01); B81C 2203/0785 (2013.01)]

20 Claims

1. A method comprising:

providing a stack by:

forming a first transfer layer over a first substrate;

forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble; and

forming a target layer in contact with the second transfer layer such that the target layer forms a top surface of the stack;

bonding the top surface of the stack to a second substrate;

separating the first transfer layer from the second transfer layer; and

removing the second transfer layer from the target layer such that the target layer remains on the second substrate.