US 12,214,574 B2
Barrier film substrate, method of making same, and use thereof
Keith W. Donaldson, Buffalo Grove, IL (US); Marshall Grove, Yakima, WA (US); and Joe Marks, Erie, CO (US)
Assigned to ENGINEERED MATERIALS, INC., Buffalo Grove, IL (US)
Filed by Engineered Materials, Inc., Buffalo Grove, IL (US)
Filed on Nov. 6, 2020, as Appl. No. 17/091,421.
Application 17/091,421 is a continuation of application No. 16/103,703, filed on Aug. 14, 2018, granted, now 10,882,289.
Claims priority of provisional application 62/545,416, filed on Aug. 14, 2017.
Prior Publication US 2021/0053325 A1, Feb. 25, 2021
Int. Cl. B32B 27/18 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 37/12 (2006.01)
CPC B32B 27/18 (2013.01) [B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 37/12 (2013.01); B32B 2250/24 (2013.01); B32B 2307/7242 (2013.01); B32B 2323/043 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A building assembly, comprising:
a building defining a building envelope; and
a barrier film substrate coupled to the building envelope such that the barrier film substrate is positioned within or around the building envelope, wherein the barrier film substrate includes:
a first layer including a polymer and a transition metal having chemical sequestering properties, the transition metal including copper, wherein the amount of copper in the first layer is in the range of between about 5% and about 23% by mass, based on the total mass of the first layer; and
a second layer aligned with the first layer, the second layer including a polymer having impeding properties greater than polyethylene for at least one chemical vapor;
whereby upon exposure to one or more chemical vapors, a reaction occurs with the copper of the first layer causing the one or more chemical vapors to break down into a plurality of chemical sub-components, the polymer of the second layer impeding the progress of the one or more chemical vapors through the second layer, extending the reaction time between the copper of the first layer and the one or more chemical vapors.