	US 12,214,549 B2
	Three-dimensional printing
Kevin P. DeKam, Corvallis, OR (US); Sterling Chaffins, Corvallis, OR (US); and Cassady Sparks Roop, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on Jul. 7, 2023, as Appl. No. 18/349,102.
Application 18/349,102 is a continuation of application No. 17/047,729, granted, now 11,712,845, previously published as PCT/US2018/056116, filed on Oct. 16, 2018.
Prior Publication US 2023/0347586 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C09D 5/23 (2006.01)

CPC B29C 64/165 (2017.08) [B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C09D 5/23 (2013.01)]

16 Claims

1. A multi-fluid kit for 3D printing, comprising:

a fusible fluid including water and a radiation absorber;

a magnetic fluid including water and magnetic particles, wherein the magnetic particles are selected from the group consisting of Fe, Co, Ni, Nd₂Fe₁₄B, Y₂Fe₁₄B, and a combination thereof; and

a detailing fluid including a detailing agent.