US 12,214,494 B2
Teaching support device
Yuma Shimura, Matsumoto (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jul. 1, 2022, as Appl. No. 17/855,944.
Claims priority of application No. 2021-110837 (JP), filed on Jul. 2, 2021.
Prior Publication US 2023/0001567 A1, Jan. 5, 2023
Int. Cl. B24B 51/00 (2006.01); B25J 9/00 (2006.01); B25J 9/16 (2006.01); B25J 11/00 (2006.01); G05B 19/409 (2006.01)
CPC B25J 9/0081 (2013.01) [B25J 9/1633 (2013.01); B25J 9/1689 (2013.01); B25J 11/0065 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A teaching support device comprising:
a memory configured to store a program; and
a processor configured to execute the program so as to:
perform teaching to a robot which has a robot arm, a tip of the robot arm being attached with a polishing tool;
control the robot arm with force control to perform a polishing task on an object, a contact point of the polishing tool to the object being a tool center point;
obtain information related to a plurality of teaching points set to a surface of the object, the tool center point of the polishing tool passing the plurality of teaching points during the polishing task;
obtain information related to a polishing parameter of the polishing task at the plurality of teaching points, the information related to the polishing parameter including the polishing tool, a size of an abrasive grain of the polishing tool, a speed of the polishing tool, and a pressing force of the polishing tool to the object; and
one teaching point of the plurality of teaching points with a color based on the polishing parameter so as to overlap the object.