US 12,214,447 B2
Synchronous motion selective soldering apparatus and method
Gregory E. Goodell, Spokane, WA (US); Carlos E. Bouras, Spokane, WA (US); and Michael A. Cable, Liberty Lake, WA (US)
Assigned to Nordson Corporation, Westlake, OH (US)
Appl. No. 16/767,154
Filed by NORDSON CORPORATION, Westlake, OH (US)
PCT Filed Nov. 27, 2018, PCT No. PCT/US2018/062536
§ 371(c)(1), (2) Date May 27, 2020,
PCT Pub. No. WO2019/108508, PCT Pub. Date Jun. 6, 2019.
Claims priority of provisional application 62/591,711, filed on Nov. 28, 2017.
Prior Publication US 2020/0384562 A1, Dec. 10, 2020
Int. Cl. B23K 3/08 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); H05K 13/04 (2006.01); B08B 3/08 (2006.01); B23K 101/42 (2006.01)
CPC B23K 3/08 (2013.01) [B23K 1/0016 (2013.01); B23K 3/0653 (2013.01); B08B 3/08 (2013.01); B23K 2101/42 (2018.08); H05K 13/0465 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method for applying solder to a workpiece, the method comprising:
receiving a first workpiece moving along a machine direction;
moving a first selective soldering nozzle along the machine direction and a direction orthogonal to the machine direction; and
applying solder from the first selective soldering nozzle to the first workpiece while the first workpiece and the first selective soldering nozzle are moving along the machine direction, whereby the first workpiece moves along the machine direction, without stopping, while the first selective soldering nozzle applies the solder to a first predetermined position on the first workpiece.