| CPC B23K 1/0056 (2013.01) [B23K 3/04 (2013.01); B23K 26/048 (2013.01); B23K 26/0626 (2013.01); B23K 26/0648 (2013.01); B23K 26/0676 (2013.01); B23K 26/0734 (2013.01); B23K 26/34 (2013.01); G02B 5/001 (2013.01); G02B 27/0916 (2013.01); G02B 27/283 (2013.01); G02B 27/286 (2013.01)] | 16 Claims |

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1. A laser soldering system, applying for processing a first element and a second element with different processing temperatures, wherein the first element is adjacent to the second element, and the laser soldering system comprises:
a laser source module configured to emit a laser beam;
a polarization adjusting assembly, comprising:
a plurality of polarization elements configured to split the laser beam into a Gaussian beam and a ring-shaped beam, wherein the Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element; and
at least one stepping motor configured to adjust a size of the ring-shaped beam;
a temperature sensor configured to monitor a temperatures of the first element and a temperature of the second element; and
a controller electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.
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