US 12,214,385 B2
Method for cleaning semiconductor process equipment and system thereof
Chun-Jung Chiu, New Taipei (TW); Chun-Hsiung Chen, New Taipei (TW); and Wan-Chen Chuang, New Taipei (TW)
Filed by Chun-Jung Chiu, New Taipei (TW); Chun-Hsiung Chen, New Taipei (TW); and Wan-Chen Chuang, New Taipei (TW)
Filed on Nov. 3, 2022, as Appl. No. 17/979,795.
Claims priority of application No. 110141279 (TW), filed on Nov. 5, 2021.
Prior Publication US 2023/0141790 A1, May 11, 2023
Int. Cl. B08B 7/00 (2006.01); B08B 7/04 (2006.01); B08B 13/00 (2006.01); H01L 21/67 (2006.01)
CPC B08B 7/0042 (2013.01) [B08B 7/04 (2013.01); B08B 13/00 (2013.01); H01L 21/67028 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method for cleaning semiconductor process equipment, adapted to apply to an object with at least one pollutant thereon, comprising steps of:
providing multi-channel optical tweezers to irradiate a single one of the at least one pollutant and locations where the at least one pollutant is neighbor to, in order to let the optical tweezers generate a resultant force to the at least one pollutant; and
providing an airflow to the object;
wherein the resultant force is greater than a maximum static friction between the at least one pollutant and the object; and
wherein the optical tweezers are applied from different directions.