US 12,213,834 B2
Ultrasound transducer with acoustic absorber structure
Daniela Marisa Fredrick, Auburn, CA (US); Charles Baumgartner, Niskayuna, NY (US); Brian Lee Bircumshaw, Oakland, CA (US); and Joseph Michael Adam, Truckee, CA (US)
Assigned to Exo Imaging, Inc., Santa Clara, CA (US)
Filed by Exo Imaging, Inc., Redwood City, CA (US)
Filed on Nov. 19, 2020, as Appl. No. 16/953,072.
Claims priority of provisional application 62/939,262, filed on Nov. 22, 2019.
Prior Publication US 2021/0153844 A1, May 27, 2021
Int. Cl. A61B 8/00 (2006.01)
CPC A61B 8/4444 (2013.01) [A61B 8/4483 (2013.01); A61B 8/546 (2013.01); C08J 2205/00 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An ultrasound probe comprising:
(a) a printed circuit board (PCB);
(b) an application-specific integrated circuit (ASIC) coupled to the PCB directly above the PCB;
(c) a piezoelectric micromachined ultrasound transducer (pMUT) coupled to the ASIC; and
(d) a thermally conductive acoustic absorber mounted between the PCB and a heatsink, the thermally conductive acoustic absorber comprising:
i) an acoustic absorber comprising a porous copper foam having a plurality of pores; and
(ii) an acoustic absorbing material comprising an epoxy and tungsten particle mixture within at least a portion of the plurality of pores of the porous copper foam.