US 11,889,670 B2
Electromagnetic interference shielding of MEMS microphone via printed circuit board
Tom Meeusen, Macquarie University (AU); Koen Erik Van den Heuvel, Macquarie University (AU); Jan Vermeiren, Macquarie University (AU); and Stijn Eeckhoudt, Macquarie University (AU)
Assigned to Cochlear Limited, Macquarie University (AU)
Appl. No. 17/293,447
Filed by Cochlear Limited, Macquarie University (AU)
PCT Filed Apr. 1, 2020, PCT No. PCT/IB2020/053103
§ 371(c)(1), (2) Date May 12, 2021,
PCT Pub. No. WO2020/208481, PCT Pub. Date Oct. 15, 2020.
Claims priority of provisional application 62/833,354, filed on Apr. 12, 2019.
Prior Publication US 2021/0410340 A1, Dec. 30, 2021
Int. Cl. H04R 25/00 (2006.01); H05K 9/00 (2006.01); A61N 1/36 (2006.01); H05K 1/11 (2006.01)
CPC H05K 9/0024 (2013.01) [A61N 1/36038 (2017.08); H04R 25/606 (2013.01); H04R 25/609 (2019.05); H04R 25/65 (2013.01); H05K 1/111 (2013.01); H05K 9/0064 (2013.01); H05K 9/0067 (2013.01); H04R 2201/003 (2013.01); H04R 2225/67 (2013.01); H05K 2201/10151 (2013.01)] 27 Claims
OG exemplary drawing
 
1. An assembly comprising:
a package comprising a housing bounding a region and an acoustic sensor within the region, the housing comprising a base with a first hole, the sensor configured to generate signals indicative of sound received by the sensor through the first hole; and
a printed circuit board in mechanical communication with the base, the printed circuit board comprising:
a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor; and
an electrically conductive layer, at least a portion of the layer extending across the second hole, the portion configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.