CPC H05K 1/144 (2013.01) [H05K 1/113 (2013.01); H05K 3/0047 (2013.01); H05K 2201/042 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10378 (2013.01)] | 20 Claims |
1. An interposer including an opening area for accommodating at least one electronic component, the interposer comprising:
a board including a first surface and a second surface that face opposite directions, an inner surface that faces the opening area, and an outer surface that faces an opposite direction to the inner surface,
wherein the outer surface is formed in a convexo-concave form having a plurality of first concave areas and a plurality of first convex areas; and
a side conductive member disposed on the first concave areas and the first convex areas of the outer surface, and formed along the convexo-concave form of the outer surface,
wherein the plurality of first concave areas and the plurality of first convex areas extend from a first corner meeting the first surface to a second corner meeting the second surface, and
wherein the inner surface has a convexo-concave form having a plurality of second concave areas and a plurality of second convex areas.
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