CPC H05K 1/141 (2013.01) [H01L 23/12 (2013.01); H05K 1/0224 (2013.01)] | 22 Claims |
1. A module comprising:
a wiring board having a first main surface, the wiring board being a ceramic board including a ground conductor;
a first component and a second component, the first component and the second component being mounted on the first main surface;
at least one conductive member disposed on the first main surface in direct contact therewith, wherein the conductive member is disposed between the first component and the second component;
a sealing resin sealing the first component, the second component, and the conductive member; and
a shield film covering an upper surface and a side surface of the sealing resin and a side surface of the wiring board, wherein
the shield film is electrically connected to the ground conductor,
the conductive member is a sintered body formed by sintering a conductive paste, and
the conductive member is a simultaneously fired member with the wiring board, and is electrically connected to the ground conductor and electrically connected to the shield film.
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