US 11,889,625 B2
Module and method of manufacturing the same
Akio Katsube, Kyoto-fu (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Dec. 15, 2021, as Appl. No. 17/644,446.
Application 17/644,446 is a continuation of application No. PCT/JP2020/024805, filed on Jun. 24, 2020.
Claims priority of application No. 2019-120089 (JP), filed on Jun. 27, 2019.
Prior Publication US 2022/0110211 A1, Apr. 7, 2022
Int. Cl. H05K 1/14 (2006.01); H01L 23/12 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/141 (2013.01) [H01L 23/12 (2013.01); H05K 1/0224 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A module comprising:
a wiring board having a first main surface, the wiring board being a ceramic board including a ground conductor;
a first component and a second component, the first component and the second component being mounted on the first main surface;
at least one conductive member disposed on the first main surface in direct contact therewith, wherein the conductive member is disposed between the first component and the second component;
a sealing resin sealing the first component, the second component, and the conductive member; and
a shield film covering an upper surface and a side surface of the sealing resin and a side surface of the wiring board, wherein
the shield film is electrically connected to the ground conductor,
the conductive member is a sintered body formed by sintering a conductive paste, and
the conductive member is a simultaneously fired member with the wiring board, and is electrically connected to the ground conductor and electrically connected to the shield film.