US 11,889,620 B2
Radio-frequency module and communication device
Yutaka Shuto, Kyoto (JP); Hiroshi Nishikawa, Kyoto (JP); and Tomomi Yasuda, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on May 5, 2022, as Appl. No. 17/662,097.
Claims priority of application No. 2021-093817 (JP), filed on Jun. 3, 2021.
Prior Publication US 2022/0394844 A1, Dec. 8, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0243 (2013.01) [H05K 1/115 (2013.01); H05K 2201/1003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a mounting board having a first major surface and a second major surface opposite to each other;
a first electronic component disposed on the first major surface of the mounting board; and
a second electronic component disposed on the first major surface of the mounting board, the second electronic component being lower in height than the first electronic component, wherein
the mounting board includes
a plurality of dielectric layers,
a plurality of conductive layers, and
a plurality of via-conductors,
in the mounting board, the plurality of dielectric layers and the plurality of conductive layers are stacked in a thickness direction of the mounting board,
the mounting board has
a first region overlapping the first electronic component when viewed in plan view in the thickness direction of the mounting board, the first region extending from the first major surface to the second major surface, and
a second region overlapping the second electronic component when viewed in plan view in the thickness direction of the mounting board, the second region extending from the first major surface to the second major surface, and
in the mounting board,
of the plurality of conductive layers, conductive layers in the first region are fewer than conductive layers in the second region, and
the first region is thinner than the second region.