US 11,889,613 B1
Heatsink device with multiple inlets and related computing device and method
Eduardo A. Castillo Orozco, Guayaquil (EC); and Abhishek Sastri, Tampa, FL (US)
Assigned to FLUIX INCORPORATED, Orlando, FL (US)
Filed by FLUIX INCORPORATED, Tampa, FL (US)
Filed on Feb. 26, 2021, as Appl. No. 17/186,150.
Claims priority of provisional application 62/981,728, filed on Feb. 26, 2020.
Int. Cl. H05K 7/20 (2006.01); F28F 23/02 (2006.01); G06F 1/20 (2006.01); F28F 27/00 (2006.01)
CPC H05K 7/20218 (2013.01) [F28F 23/02 (2013.01); F28F 27/006 (2013.01); G06F 1/20 (2013.01); H05K 7/20254 (2013.01); H05K 7/20409 (2013.01); F28F 2250/08 (2013.01)] 19 Claims
OG exemplary drawing
 
17. A method for making a heatsink device for an electronic component, the method comprising:
forming a base plate having a body, and a plurality of legs extending laterally outward from the body, and defining an opening within the body; and
forming a heat exchanger comprising
a lower body under the base plate and abutting the electronic component,
an upper body coupled to the lower body to define a fluid chamber therein, and
a medial plate between the lower body and the upper body and having first and second slots therein;
the upper body defining first and second inlet passageways respectively aligned with the first and second slots, and an outlet passageway for fluid in the fluid chamber;
the first and second slots configured to cause the fluid to flow laterally within the fluid chamber.