US 11,888,286 B2
Laser chip for flip-chip bonding on silicon photonics chips
Xiaoguang He, San Jose, CA (US); and Radhakrishnan L. Nagarajan, San Jose, CA (US)
Assigned to MARVELL ASIA PTE LTD, Singapore (SG)
Filed by INPHI CORPORATION, San Jose, CA (US)
Filed on Oct. 21, 2020, as Appl. No. 17/076,162.
Prior Publication US 2022/0123518 A1, Apr. 21, 2022
Int. Cl. H01S 5/02 (2006.01); H01S 5/0238 (2021.01); H01S 5/028 (2006.01); H01S 5/0237 (2021.01); H01S 5/227 (2006.01); H01S 5/22 (2006.01); H01S 5/0234 (2021.01)
CPC H01S 5/0238 (2021.01) [H01S 5/0202 (2013.01); H01S 5/0234 (2021.01); H01S 5/0237 (2021.01); H01S 5/0287 (2013.01); H01S 5/2206 (2013.01); H01S 5/2275 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A laser chip for flip-chip bonding to a silicon photonics chip comprising a waveguide, the laser chip comprising:
an active region disposed in the laser chip along a plane parallel to the waveguide in the silicon photonics chip; and
a first pair of stoppers formed on the laser chip to mate with a second pair of stoppers formed on the silicon photonics chip when the laser chip is bonded to a bonding site on the silicon photonics chip, the first and second pairs of stoppers extending along an axis perpendicular to the plane, at least one of the first pair of stoppers and the second pair of stoppers being configured to align the active region away from the waveguide towards the bonding site on the silicon photonics chip,
wherein due to the alignment, the waveguide is at a first distance from the bonding site, the active region is at a second distance from the bonding site, the first and second distances being along the axis perpendicular to the plane parallel to the waveguide, the first distance being greater than the second distance.