US 11,888,279 B2
Method of attaching a contact element to a conductive path a conductor plate
Andre Martin Dressel, Lampertheim (DE); Gunther Chritz, Birkenau (DE); and Jens Huber, Heppenheim (DE)
Assigned to TE Connectivity Germany GmbH, Bensheim (DE)
Filed by TE Connectivity Germany GmbH, Bensheim (DE)
Filed on Aug. 14, 2019, as Appl. No. 16/540,229.
Claims priority of application No. 102018213639.4 (DE), filed on Aug. 14, 2018.
Prior Publication US 2020/0059056 A1, Feb. 20, 2020
Int. Cl. H01R 43/02 (2006.01); H01R 4/02 (2006.01); H01R 9/03 (2006.01); H01R 12/57 (2011.01); H01R 13/15 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01)
CPC H01R 43/0221 (2013.01) [H01R 4/02 (2013.01); H01R 9/03 (2013.01); H01R 12/57 (2013.01); H01R 13/15 (2013.01); H05K 1/181 (2013.01); H05K 3/328 (2013.01); H05K 2201/10628 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method of attaching a contact element to a conductor plate, comprising:
welding the contact element to a conductive path of the conductor plate in a surface-mounted manner with a laser beam, the laser beam melts a material of the contact element only in a fused region, the fused region has a width smaller than a width of the contact element by a factor of ten or more, the fused region has a radius at a surface of the contact element that is greater than or equal to a width of the laser beam and less than or equal to three times the width of the laser beam; and
flattening an end of the contact element before the welding step, the end of the contact element is welded to the conductive path in the welding step.