US 11,888,210 B2
Electronic package and method of manufacturing the same
Jenchun Chen, Kaohsiung (TW); and Ya-Wen Liao, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 6, 2021, as Appl. No. 17/396,601.
Prior Publication US 2023/0037915 A1, Feb. 9, 2023
Int. Cl. H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01Q 1/42 (2006.01); H01Q 1/40 (2006.01); H01Q 21/06 (2006.01); H01Q 21/08 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 23/66 (2013.01); H01Q 1/40 (2013.01); H01Q 1/422 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/065 (2013.01); H01Q 21/08 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6688 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna; and
a directing element covering the antenna structure, the directing element having a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna,
wherein the first portion of the directing element has an area larger than an area of the first antenna and less than an area of the second antenna.