US 11,888,139 B2
Temperature adjustment circuit
Kengo Aoki, Saitama (JP); Tetsu Miyamoto, Saitama (JP); Ayumu Uno, Tokyo (JP); Takeshi Otani, Saitama (JP); and Daisuke Komazawa, Saitama (JP)
Assigned to HONDA MOTOR CO., LTD., Tokyo (JP)
Appl. No. 17/415,364
Filed by HONDA MOTOR CO., LTD., Tokyo (JP)
PCT Filed Dec. 21, 2018, PCT No. PCT/JP2018/047375
§ 371(c)(1), (2) Date Jun. 17, 2021,
PCT Pub. No. WO2020/129259, PCT Pub. Date Jun. 25, 2020.
Prior Publication US 2022/0069385 A1, Mar. 3, 2022
Int. Cl. H01M 10/6568 (2014.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/48 (2006.01); H02J 7/00 (2006.01); B60L 53/302 (2019.01); B60L 58/26 (2019.01)
CPC H01M 10/6568 (2015.04) [B60L 53/302 (2019.02); B60L 58/26 (2019.02); H01M 10/486 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H02J 7/00309 (2020.01)] 15 Claims
OG exemplary drawing
 
1. A temperature adjustment circuit comprising:
a first temperature adjustment circuit that includes:
a first pump that is configured to supply a heat-transfer medium to a first cooling target and
a first heat exchanging part that transfers heat between the heat-transfer medium and an air-conditioning refrigerant;
a second temperature adjustment circuit that includes:
a second pump that is configured to supply the heat-transfer medium to a second cooling target and
a second heat exchanging part that transfers heat between the heat-transfer medium and outside air;
a first connection path that connects a first connection portion of the first temperature adjustment circuit and a first connection portion of the second temperature adjustment circuit;
a second connection path that connects a second connection portion of the first temperature adjustment circuit and a second connection portion of the second temperature adjustment circuit; and
a switching part that is configured to switch between
a circulation state where the heat-transfer medium is circulated through a connection circuit in which the first temperature adjustment circuit and the second temperature adjustment circuit are connected to each other and
a non-circulation state where the heat-transfer medium is not circulated through the connection circuit,
wherein the first heat exchanging part is disposed between the second connection portion of the first temperature adjustment circuit and the first connection portion of the first temperature adjustment circuit in a flow direction of the heat-transfer medium in the first temperature adjustment circuit in the non-circulation state, and
wherein the switching part includes:
a first shut-off valve that is provided between the second connection portion of the first temperature adjustment circuit and the first heat exchanging part in a flow direction of the heat-transfer medium in the first temperature adjustment circuit in the non-circulation state and
a second shut-off valve that is provided between the first connection portion of the second temperature adjustment circuit and the first connection portion of the first temperature adjustment circuit in a flow direction of the heat-transfer medium in the connection circuit in the circulation state.