US 11,888,087 B1
Light emitting diodes manufacture and assembly
Céline Claire Oyer, Cork (IE); and Allan Pourchet, Cork (IE)
Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed by Meta Platforms Technologies, LLC
Filed on Jan. 14, 2022, as Appl. No. 17/575,920.
Application 17/575,920 is a continuation of application No. 16/595,870, filed on Oct. 8, 2019, granted, now 11,227,970.
Claims priority of provisional application 62/747,460, filed on Oct. 18, 2018.
Int. Cl. H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/06 (2010.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01)
CPC H01L 33/0095 (2013.01) [H01L 21/6838 (2013.01); H01L 22/14 (2013.01); H01L 33/06 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
forming an epitaxial layer on a starter substrate;
attaching the epitaxial layer onto a carrier substrate;
etching away the starter substrate;
etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies;
forming device-side bumps on the plurality of LED dies;
forming backplane-side bumps on at least one of one or more pre-determined locations on a backplane, the at least one of one or more pre-determined locations corresponding to one or more selected LED dies of the plurality of LED dies;
establishing one or more conductive bonds between the device-side bumps of the one or more selected LED dies and the corresponding backplane-side bumps on backplane; and
moving the carrier substrate away from the backplane to transfer the one or more LED dies to the backplane.