US 11,888,023 B2
Partial discharge suppression in high voltage solid-state devices
Stephen Sampayan, Manteca, CA (US); and Kristin Cortella Sampayan, Manteca, CA (US)
Assigned to Lawrence Livermore National Security, LLC, Livermore, CA (US); and Opcondys, Inc., Manteca, CA (US)
Filed by Lawrence Livermore National Security, LLC, Livermore, CA (US); and Opcondys, Inc., Manteca, CA (US)
Filed on Jan. 4, 2023, as Appl. No. 18/150,000.
Application 18/150,000 is a continuation of application No. 17/177,884, filed on Feb. 17, 2021, granted, now 11,557,646.
Claims priority of provisional application 62/977,564, filed on Feb. 17, 2020.
Prior Publication US 2023/0145347 A1, May 11, 2023
Int. Cl. H01L 29/06 (2006.01); H01L 21/762 (2006.01)
CPC H01L 29/0611 (2013.01) [H01L 21/762 (2013.01); H01L 29/0649 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate;
a first electrical contact positioned on the substrate; and
a multi-layer encapsulation film surrounding at least a top surface of the first electrical contact and at least part of the substrate, wherein the multi-layer encapsulation film comprises multiple layers of one or more dielectric materials, wherein an interface between two adjacent layers of the multiple layers is configured to include molecular bonds to prevent charge carriers from crossing between the two adjacent layers.