CPC H01L 29/0611 (2013.01) [H01L 21/762 (2013.01); H01L 29/0649 (2013.01)] | 20 Claims |
1. An electronic device, comprising:
a substrate;
a first electrical contact positioned on the substrate; and
a multi-layer encapsulation film surrounding at least a top surface of the first electrical contact and at least part of the substrate, wherein the multi-layer encapsulation film comprises multiple layers of one or more dielectric materials, wherein an interface between two adjacent layers of the multiple layers is configured to include molecular bonds to prevent charge carriers from crossing between the two adjacent layers.
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