US 11,888,011 B2
Electronic detection module for testing micro chips
Hsien-Te Chen, Taipei (TW)
Assigned to ULTRA DISPLAY TECHNOLOGY CORP., Taipei (TW)
Filed by ULTRA DISPLAY TECHNOLOGY CORP., Taipei (TW)
Filed on Aug. 13, 2020, as Appl. No. 16/992,838.
Claims priority of application No. 108129149 (TW), filed on Aug. 15, 2019.
Prior Publication US 2021/0050381 A1, Feb. 18, 2021
Int. Cl. H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 27/146 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 27/14603 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic detection module for testing micro photoelectric chips or micro semiconductor chips, comprising:
an electronic detection interface, comprising:
a substrate structure including a circuit film, wherein the circuit film comprises a plurality of circuit units in array;
a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips, wherein the detection units are disposed on a surface of the substrate structure and are corresponded to the circuit units in a respective manner, and each of the detection units includes at least one resilient conductive pillar electrically connected to each of the circuit units through a conductive pad, wherein each of the resilient conductive pillars comprises a non-conductive photoresist and a conductive layer covering the non-conductive photoresist; and
a plurality of image detecting units in array disposed away from the electronic detection interface with a predetermined distance, wherein the image detecting units are corresponded to the detection units of the electronic detection interface in a respect manner, and each of the image detecting units captures at least one image parameter from the corresponding one of the detection units.