US 11,887,974 B2
Method of operating microelectronic package
Wenliang Chen, Zhubei (TW); Lin Ma, Zhubei (TW); and Alessandro Minzoni, Zhubei (TW)
Assigned to AP Memory Technology Corp., Zhubei (TW)
Filed by AP Memory Technology Corp., Zhubei (TW)
Filed on Feb. 2, 2022, as Appl. No. 17/591,561.
Application 17/591,561 is a continuation of application No. 17/019,303, filed on Sep. 13, 2020, granted, now 11,315,916.
Application 17/019,303 is a continuation of application No. 16/232,417, filed on Dec. 26, 2018, granted, now 10,811,402, issued on Oct. 20, 2020.
Prior Publication US 2022/0157800 A1, May 19, 2022
Int. Cl. H01L 25/00 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/94 (2013.01); H01L 25/50 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16148 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of operating a microelectronic package, comprising a processing device stacking vertically with at least one memory device, the method comprising steps of:
reading data stored in a plurality of memory cells of a plurality of memory units of the memory device, with the processing device, with a plurality of signal channels each of which is dedicated to transmit signals from the processing device to one of the memory units and vice versa;
performing a test, with the processing device, on the memory cells in the memory units of the at least one memory device; and
indicating a failure found with the test, with the processing device.