US 11,887,970 B2
Stacked microfeature devices and associated methods
Mung Suan Heng, Singapore (SG); Kok Chua Tan, Singapore (SG); Vince Chan Seng Leong, Singapore (SG); and Mark S. Johnson, Meridian, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jun. 27, 2022, as Appl. No. 17/850,122.
Application 13/845,953 is a division of application No. 12/820,704, filed on Jun. 22, 2010, granted, now 8,400,780, issued on Mar. 19, 2013.
Application 12/820,704 is a division of application No. 11/416,740, filed on May 3, 2006, granted, now 7,742,313, issued on Jun. 22, 2013.
Application 17/850,122 is a continuation of application No. 16/104,862, filed on Aug. 17, 2018, granted, now 11,373,979.
Application 16/104,862 is a continuation of application No. 15/368,158, filed on Dec. 2, 2016, granted, now 10,062,667, issued on Aug. 28, 2018.
Application 15/368,158 is a continuation of application No. 13/845,953, filed on Mar. 18, 2013, granted, now 9,515,046, issued on Dec. 6, 2016.
Application 11/416,740 is a continuation of application No. 10/651,912, filed on Aug. 29, 2003, granted, now 7,071,421, issued on Jul. 4, 2006.
Prior Publication US 2023/0008716 A1, Jan. 12, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4554 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48149 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/48496 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85951 (2013.01); H01L 2224/85986 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49144 (2015.01); Y10T 29/49149 (2015.01)] 20 Claims
OG exemplary drawing
 
1. A microfeature device assembly, comprising:
a first die having a first bond pad surface, wherein the first bond pad surface includes a plurality of first device bond pads aligned along a first axis, a plurality of first intermediate bond pads aligned along a second axis, and a plurality of wirebond pads, wherein:
a first subset of the plurality of wirebond pads are electrically coupled to a corresponding pair from the plurality of first device bond pads and the plurality of first intermediate bond pads,
a second subset of the plurality of wirebond pads are each electrically coupled to an individual one of the plurality of first device bond pads, and
a third subset of the plurality of wirebond pads are each electrically coupled to an individual one of the plurality of first intermediate device bond pads;
a second die carried by the first die and having a second bond pad surface facing the first bond pad surface, wherein the second bond pad surface includes a plurality of second device bond pads each vertically aligned with a corresponding one of the plurality of first intermediate bond pads along the second axis and a plurality of second intermediate bond pads each vertically aligned with a corresponding one of the plurality of first device bond pads along the first axis; and
a conductive member disposed on each of the plurality of first intermediate bond pads and individually coupling the plurality of first intermediate bond pads to the plurality of second device bond pads.