US 11,887,967 B2
Semiconductor device package and method of manufacturing the same
Shang-Ruei Wu, Kaohsiung (TW); Chien-Yuan Tseng, Kaohsiung (TW); Meng-Jen Wang, Kaohsiung (TW); Chen-Tsung Chang, Kaohsiung (TW); Chih-Fang Wang, Kaohsiung (TW); Cheng-Han Li, Kaohsiung (TW); Chien-Hao Chen, Kaohsiung (TW); An-Chi Tsao, Kaohsiung (TW); and Per-Ju Chao, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 4, 2021, as Appl. No. 17/493,709.
Application 17/493,709 is a continuation of application No. 16/779,249, filed on Jan. 31, 2020, granted, now 11,139,274.
Claims priority of provisional application 62/799,701, filed on Jan. 31, 2019.
Prior Publication US 2022/0028836 A1, Jan. 27, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/02631 (2013.01); H01L 21/76838 (2013.01); H01L 23/3121 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
a connection structure disposed on the first surface of the substrate;
a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed by the package body and configured to provide an external interconnection;
a first electronic component disposed on the second surface of the substrate,
wherein the first electronic component is exposed by the package body.