US 11,887,962 B2
Microelectronic structures including bridges
Omkar G. Karhade, Chandler, AZ (US); Nitin A. Deshpande, Chandler, AZ (US); Mohit Bhatia, Chandler, AZ (US); Sairam Agraharam, Chandler, AZ (US); Edvin Cetegen, Chandler, AZ (US); Anurag Tripathi, Gilbert, AZ (US); Malavarayan Sankarasubramanian, Chandler, AZ (US); Jan Krajniak, Mesa, AZ (US); Manish Dubey, Chandler, AZ (US); Jinhe Liu, Chandler, AZ (US); Wei Li, Chandler, AZ (US); and Jingyi Huang, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 16, 2020, as Appl. No. 16/902,927.
Prior Publication US 2021/0391295 A1, Dec. 16, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/30 (2013.01) [H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 24/17 (2013.01); H01L 2224/1703 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A microelectronic structure, comprising:
a substrate;
a cavity at a face of the substrate; and
a bridge component in the cavity, wherein the bridge component includes a first face and an opposing second face, the second face of the bridge component is between the first face of the bridge component and the substrate, the bridge component includes a first interconnect material comprising a first solder at the first face of the bridge component, the bridge component includes a second interconnect material comprising a second solder at the second face of the bridge component, and the first solder has a higher melting point than the second solder.