US 11,887,958 B2
Coplanar bump contacts of differing sizes
Cheng-Yang Su, Hukou Township (TW)
Assigned to STMICROELECTRONICS LTD, Kowloon (HK)
Filed by STMICROELECTRONICS LTD, Kowloon (HK)
Filed on Aug. 16, 2021, as Appl. No. 17/403,752.
Claims priority of provisional application 63/068,291, filed on Aug. 20, 2020.
Prior Publication US 2022/0059486 A1, Feb. 24, 2022
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/14 (2013.01) [H01L 24/11 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1405 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate having a first surface;
a ring-shaped conductive structure on the substrate, the ring-shaped conductive structure extending away from the substrate, the ring-shaped conductive structure including:
a second surface facing away from the substrate;
an opening extending towards the substrate;
an interior sidewall that surrounds the opening;
an exterior sidewall that surrounds the opening, the interior sidewall, and the second surface; and
a first diameter; and
a cylindrical conductive structure on the substrate, the cylindrical conductive structure extending away from the substrate, the cylindrical conductive structure is spaced apart from the ring-shaped conductive structure, and the cylindrical conductive structure including a second diameter less than the first diameter.