CPC H01L 24/14 (2013.01) [H01L 24/11 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1405 (2013.01)] | 18 Claims |
1. A device, comprising:
a substrate having a first surface;
a ring-shaped conductive structure on the substrate, the ring-shaped conductive structure extending away from the substrate, the ring-shaped conductive structure including:
a second surface facing away from the substrate;
an opening extending towards the substrate;
an interior sidewall that surrounds the opening;
an exterior sidewall that surrounds the opening, the interior sidewall, and the second surface; and
a first diameter; and
a cylindrical conductive structure on the substrate, the cylindrical conductive structure extending away from the substrate, the cylindrical conductive structure is spaced apart from the ring-shaped conductive structure, and the cylindrical conductive structure including a second diameter less than the first diameter.
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