US 11,887,939 B2
Shielded radio-frequency devices
Pietro Natale Alessandro Chyurlia, Ottawa (CA)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Jun. 27, 2022, as Appl. No. 17/850,971.
Application 17/850,971 is a continuation of application No. 16/852,453, filed on Apr. 18, 2020, granted, now 11,373,959.
Claims priority of provisional application 62/836,512, filed on Apr. 19, 2019.
Prior Publication US 2022/0415823 A1, Dec. 29, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/3114 (2013.01); H01L 23/66 (2013.01); H01L 24/45 (2013.01); H01L 24/94 (2013.01); H01L 2223/6611 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing a radio-frequency device, the method comprising:
forming or providing a substrate;
fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side;
mounting the front side of the flip chip die on the substrate;
forming a carrier wafer layer disposed over the back side of the flip chip die;
forming a conductive layer disposed over the carrier wafer layer; and
implementing a plurality of shielding wirebonds to provide an electrical connection between the conductive layer and a ground plane of the substrate, such that the conductive layer and the plurality of shielding wirebonds provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.