CPC H01L 23/552 (2013.01) [H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3025 (2013.01)] | 19 Claims |
1. An apparatus comprising:
a ground plane;
an integrated circuit chip disposed on the ground plane, the integrated circuit chip comprising one or more electrically conductive layers encircling a periphery of the integrated circuit chip; and
a plurality of bondwires electrically coupling the one or more electrically conductive layers to the ground plane.
|