US 11,887,928 B2
Package structure with interposer encapsulated by an encapsulant
Yung-Shun Chang, Kaohsiung (TW); Sheng-Wen Yang, Kaohsiung (TW); Teck-Chong Lee, Kaohsiung (TW); and Yen-Liang Huang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 17, 2021, as Appl. No. 17/555,227.
Prior Publication US 2023/0197600 A1, Jun. 22, 2023
Int. Cl. H01L 23/522 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 23/12 (2013.01); H01L 23/31 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A package structure, comprising:
an encapsulant having a top surface and a bottom surface opposite to the top surface; and an interposer encapsulated by the encapsulant, comprising:
a main body having a first surface and a second surface opposite to the first surface;
an interconnector disposed on the first surface and exposed from the top surface of the encapsulant; and
a stop layer on the second surface, wherein a bottom surface of the stop layer is lower than the second surface;
wherein the stop layer has a surface substantially aligned with the bottom surface of the encapsulant.