US 11,887,921 B2
Method of producing semiconductor devices and corresponding semiconductor device
Andrea Albertinetti, Sizzano (IT); and Marifi Corregidor Cagud, Johor (MY)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT); and STMicroelectronics SDN BHD, Muar (MY)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT); and STMicroelectronics SDN BHD, Muar (MY)
Filed on Aug. 25, 2021, as Appl. No. 17/412,007.
Claims priority of application No. 102020000020605 (IT), filed on Aug. 28, 2020.
Prior Publication US 2022/0068788 A1, Mar. 3, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/83192 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method, comprising:
attaching a semiconductor die onto an area of a substrate, wherein the semiconductor die comprises a warped semiconductor die having mutually opposed first and second surfaces, the first surface concave and the second surface convex;
wherein attaching comprises:
dispensing a first mass of die attach material having a first rheology onto said area;
dispensing a second mass of die attach material having a second rheology different from the first rheology onto the first mass of die attach material;
wherein the second mass of die attach material provides a raised formation of die attach material relative to the first mass of die attach material;
wherein dispensing the second mass of die attach material comprises dispensing the second mass of die attach material centrally of the first mass of die attach material; and
placing the warped semiconductor die onto the first and second mass of die attach material with the first concave surface of the warped semiconductor die facing the substrate having the die attach material dispensed thereon.