US 11,887,915 B2
Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and a method of manufacturing a semiconductor device
Masafumi Suzuhara, Yokohama (JP)
Assigned to Amkor Technology Japan, Inc.
Filed by Amkor Technology Japan, Inc., Usuki (JP)
Filed on Apr. 26, 2022, as Appl. No. 17/729,183.
Application 17/729,183 is a continuation of application No. 16/745,920, filed on Jan. 17, 2020, granted, now 11,322,431.
Application 16/745,920 is a continuation of application No. 16/053,965, filed on Aug. 3, 2018, granted, now 10,559,523, issued on Feb. 11, 2020.
Application 16/053,965 is a continuation of application No. 15/446,426, filed on Mar. 1, 2017, granted, now 10,062,638, issued on Aug. 28, 2018.
Claims priority of application No. 2016-044341 (JP), filed on Mar. 8, 2016.
Prior Publication US 2022/0254704 A1, Aug. 11, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/50 (2006.01); H01L 21/288 (2006.01); H01L 21/52 (2006.01); H01L 21/76 (2006.01); H01L 21/78 (2006.01); H01L 23/28 (2006.01)
CPC H01L 23/49524 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/56 (2013.01); H01L 23/3142 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49565 (2013.01); H01L 23/49582 (2013.01); H01L 23/3107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a lead frame comprising a first external connection terminal, wherein the first external connection terminal comprises:
a bottom end;
an outer terminal portion comprising a side end; and
an inner terminal portion opposite to and coupled to the outer terminal portion;
a semiconductor device coupled to the first external connection terminal with a first interconnect;
a sealing member covering the first external connection terminal and the semiconductor device and comprising a top side, a bottom side opposite to the bottom side, and a lateral side;
a plating layer; and
a groove extending inward from the bottom side of the sealing member adjoining the inner terminal portion;
wherein:
the bottom end of the first external connection terminal is exposed from the bottom side of the sealing member;
the side end of the outer terminal portion is exposed from the sealing member;
at least part of the inner terminal portion is exposed from the sealing member within the groove;
the plating layer fully covers the side end of the outer terminal portion; and
the first interconnect is the only internal attachment to the first external connection terminal.